Chad B. O’Neal

Challenges in the packaging of MEMS

Chad B. O’Neal, Ajay P. Malshe, Sushila Singh et al. · 2003 · 97 citations · Full text

Advanced Packaging, Chip-scale Package, Engineering +13

Characterization of High-Pressure $\hbox{XeF}_{2}$ Vapor-Phase Silicon Etching for MEMS Processing

Clayton Easter, Chad B. O’Neal · Journal of Microelectromechanical Systems · 2009 · 26 citations

Engineering, Mechanical Engineering, Microelectromechanical Systems +16

Advanced Materials for High Temperature, High Performance, Wide Bandgap Power Modules

Chad B. O’Neal, Brad McGee, Brice McPherson et al. · Journal of Electronic Materials · 2015 · 19 citations

Materials Science, Advanced Packaging, Wide-bandgap Semiconductor +8

Using A Materials Concept Inventory To Assess An Introductory Materials Class: Potential And Problems

William Jordan, Henry E. Cardenas, Chad B. O’Neal · 2020 · 17 citations · Full text

Fabrication and Testing of a PZT Strain Sensor for Soil Applications

Joel Soman, Chad B. O’Neal · IEEE Sensors Journal · 2010 · 15 citations

Electrical Engineering, Engineering, Pzt Strain Sensor +13