Concepedia

Pressure Sensor Packaging

Pressure Sensor Packaging is a methodological framework that defines the structural and environmental integration of pressure sensing elements to ensure mechanical protection, signal integrity, and operational reliability under specified conditions.

57

Publications

1.7K

Citations

242

Authors

90

Institutions

Publications per year

2017–2026

11

Parents

Publications

57

Sensitivity analysis of packaging effect of silicon-based piezoresistive pressure sensor

Tsung-Lin Chou, Chen-Hung Chu, Chun‐Te Lin et al. · Sensors and Actuators A Physical · 2009 · 81 citations

, , +14

Fully Printed and Flexible Carbon Nanotube Transistors for Pressure Sensing in Automobile Tires

Joseph Andrews, Jorge A. Cardenas, Chin Jie Lim et al. · IEEE Sensors Journal · 2018 · 79 citations

, , +17

Six-Degree-of-Freedom Sensor Fish Design and Instrumentation

Zhiqun Deng, Thomas J. Carlson, Pascal Joanne et al. · Sensors · 2007 · 77 citations · Full text

, , +17

Packaging Effect on MEMS Pressure Sensor Performance

Rudolf H. Krondorfer, Yeong K. Kim · IEEE Transactions on Components and Packaging Technologies · 2007 · 71 citations

, , +17

Highly Sensitive Iontronic Pressure Sensor with Side‐by‐Side Package Based on Alveoli and Arch Structure

Zhi Ding, Weijian Li, Weidong Wang et al. · Advanced Science · 2024 · 64 citations · Full text

, , +16

1–5 of 57

Authors

242

  1. YT
    Yu‐Chong Tai

    California Institute of Technology, United States

    3 publications · 45 citations

    3

    h-index

  2. RS
    Robert S. Okojie

    Glenn Research Center, United States

    3 publications · 107 citations

    3

    h-index

  3. GM
    Glenn M. Beheim

    Glenn Research Center, United States

    3 publications · 98 citations

    3

    h-index

  4. FC
    F. Campabadal

    Institut de Microelectrònica de Barcelona, Spain

    3 publications · 77 citations

    3

    h-index

  5. KC
    Kuo‐Ning Chiang

    National Tsing Hua University, Taiwan

    3 publications · 159 citations

    3

    h-index

1–5 of 242

Institutions

90

  1. Glenn Research Center

    Cleveland, United States

    4 h-index

    10 publications

    394 citations

  2. National Tsing Hua University

    Hsinchu, Taiwan

    3 h-index

    11 publications

    617 citations

  3. Georgia Institute of Technology

    Atlanta, United States

    3 h-index

    5 publications

    213 citations

  4. California Institute of Technology

    Pasadena, United States

    3 h-index

    8 publications

    121 citations

  5. Xi'an Jiaotong University

    Xi'an, China

    2 h-index

    7 publications

    165 citations

  6. Technische Universität Berlin

    Berlin, Germany

    2 h-index

    12 publications

    222 citations

  7. Fraunhofer Institute for Reliability and Microintegration

    Berlin, Germany

    2 h-index

    13 publications

    302 citations

  8. Industrial Technology Research Institute

    Hsinchu, Taiwan

    2 h-index

    4 publications

    129 citations

1–8 of 90

Venues

  1. Sensors and Actuators A Physical

    13 publications · 432 citations

    13

    h-index

  2. Sensors

    7 publications · 240 citations

    7

    h-index

  3. IEEE Sensors Journal

    3 publications · 108 citations

    3

    h-index

  4. Journal of Micromechanics and Microengineering

    JMM · 3 publications · 86 citations

    3

    h-index

  5. Biomedical Microdevices

    2 publications · 45 citations

    2

    h-index

1–5