Adriana Lapadatu

CMOS-Integrated Si/SiGe Quantum-Well Infrared Microbolometer Focal Plane Arrays Manufactured With Very Large-Scale Heterogeneous 3-D Integration

Fredrik Forsberg, Adriana Lapadatu, Gjermund Kittilsland et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2014 · 42 citations · Full text

Engineering, Device Integration, Integrated Photonics +21

Scanning acoustic gigahertz microscopy for metrology applications in three-dimensional integration technologies

Sebastian Brand, Adriana Lapadatu, Tatjana Djuric et al. · Journal of Micro/Nanolithography MEMS and MOEMS · 2014 · 34 citations

Fluxless wafer-level Cu-Sn bonding for micro- and nanosystems packaging

Nils Høivik, Kaiying Wang, Knut E. Aasmundtveit et al. · 2010 · 31 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +17

Very large scale heterogeneous integration (VLSHI) and wafer-level vacuum packaging for infrared bolometer focal plane arrays

Fredrik Forsberg, Niclas Roxhed, Andreas Fischer et al. · Infrared Physics & Technology · 2013 · 25 citations

Wafer Scale Processing, Engineering, Advanced Packaging (Semiconductors) +9

High-performance long wave infrared bolometer fabricated by wafer bonding

Adriana Lapadatu, Gjermund Kittilsland, A. Elfving et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2010 · 25 citations

Novel Microbolometer, Engineering, Device Integration +18