Publication | Closed Access
Very large scale heterogeneous integration (VLSHI) and wafer-level vacuum packaging for infrared bolometer focal plane arrays
25
Citations
33
References
2013
Year
Wafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)Device IntegrationThree-dimensional Heterogeneous IntegrationInfrared SensorApplied PhysicsWafer-level Vacuum PackagingInfrared OpticElectronic PackagingInstrumentationMicroelectronics
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