Jengyi Yu

Predicting synergy in atomic layer etching

Keren J. Kanarik, Samantha Tan, Wenbing Yang et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2017 · 116 citations · Full text

Materials Science, Surface Characterization, Engineering +13

Advanced metallization scheme for 3×50µm via middle TSV and beyond

Stefaan Van Huylenbroeck, Yunlong Li, N. Heylen et al. · 2015 · 18 citations

Metallization Scheme, Engineering, Chemical Deposition +16

Dielectric liner reliability in via-middle through silicon vias with 3 Micron diameter

Yunlong Li, Stefaan Van Huylenbroeck, Philippe Roussel et al. · Microelectronic Engineering · 2016 · 12 citations

3D Ic Architecture, Electrical Engineering, Engineering +11

Integrated approach to improving local CD uniformity in EUV patterning

Andrew Liang, Jan Hermans, Timothy H. Tran et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2017 · 12 citations

Optical Materials, Engineering, Electron-beam Lithography +18

Advanced integrated metallization enables 3D-IC TSV scaling

Jengyi Yu, Sanjay Gopinath, Praveen Nalla et al. · 2015 · 11 citations

Materials Science, 3D Ic Architecture, Electrical Engineering +15