Praveen Nalla

Study of bimetallic corrosion related to Cu interconnects using micropattern corrosion screening method and Tafel plots

Kyle Yu, Karthikeyan S. Pillai, Praveen Nalla et al. · Journal of Applied Electrochemistry · 2009 · 18 citations

Materials Science, Materials Engineering, Electrical Engineering +9

Advanced metallization scheme for 3×50µm via middle TSV and beyond

Stefaan Van Huylenbroeck, Yunlong Li, N. Heylen et al. · 2015 · 18 citations

Metallization Scheme, Engineering, Chemical Deposition +16

Development of electroless Co via-prefill to enable advanced BEOL metallization and via resistance reduction

Yu Jiang, Praveen Nalla, Yana Matsushita et al. · 2016 · 14 citations

Materials Science, Materials Engineering, Chemical Engineering +15

Micro-pattern Corrosion Screening on Bimetallic Corrosion for Microelectronic Application

Kyle Yu, Sirish Rimal, Muthappan Asokan et al. · Electrochimica Acta · 2016 · 13 citations

Materials Engineering, Materials Science, Corrosion Protection +6

Advanced integrated metallization enables 3D-IC TSV scaling

Jengyi Yu, Sanjay Gopinath, Praveen Nalla et al. · 2015 · 11 citations

Materials Science, 3D Ic Architecture, Electrical Engineering +15