Kuo‐Shu Kao

Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration

Ching-Kuan Lee, Tao‐Chih Chang, Yu-Jiau Huang et al. · 2011 · 40 citations

Engineering, Reliability Assessment, Integrated Circuits +21

Development of fluxless chip-on-wafer bonding process for 3DIC chip stacking with 30μm pitch lead-free solder micro bumps and reliability characterization

Chau‐Jie Zhan, Jing-Ye Juang, Yu-Min Lin et al. · 2011 · 36 citations

Materials Science, 3D Ic Architecture, Electrical Engineering +15

Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration

Ching-Kuan Lee, Tao‐Chih Chang, John H. Lau et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 32 citations

Engineering, Wafer Bumping, Interconnect (Integrated Circuits) +20

Reliable Microjoints Formed by Solid–Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture

Jing‐Yao Chang, Ren-Shin Cheng, Kuo‐Shu Kao et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 32 citations

Cu Pillar, Engineering, Mechanical Engineering +23

On the Mechanism of Treeing Inhibition by Additives in Polyethylene

Demin Tu, Lingfeng Wu, Xiaoping Wu et al. · IEEE Transactions on Electrical Insulation · 1982 · 26 citations

Engineering, Chemistry, Charge Transport +22