Jing‐Yao Chang

Development of Cu-Ag pastes for high temperature sustainable bonding

Ching-Huan Hsiao, Wan-Ting Kung, Jenn‐Ming Song et al. · Materials Science and Engineering A · 2016 · 54 citations

Natural Sciences, Materials Engineering, Materials Science +6

Reliable Microjoints Formed by Solid–Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture

Jing‐Yao Chang, Ren-Shin Cheng, Kuo‐Shu Kao et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 33 citations

Engineering, Materials Engineering, Materials Science +17

Investigation of pre-bending substrate design in packaging assembly of an IGBT power module

Chang‐Chun Lee, Kuo‐Shu Kao, Leon Lin et al. · Microelectronic Engineering · 2013 · 24 citations

Engineering, Electrical Engineering, Materials Science +16

Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP

Chau‐Jie Zhan, Pei-Jer Tzeng, John H. Lau et al. · 2012 · 21 citations

Engineering, Computer Engineering, Packaging Design +15

Effects of UBM structure/material on the reliability performance of 3D chip stacking with 30μm-pitch solder micro bump interconnections

Shin‐Yi Huang, Chau‐Jie Zhan, Yu‐Wei Huang et al. · 2012 · 15 citations

Engineering, Electrical Engineering, Materials Engineering +17