Ren-Shin Cheng

Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration

Ching-Kuan Lee, Tao‐Chih Chang, Yu-Jiau Huang et al. · 2011 · 40 citations

Engineering, Reliability Assessment, Integrated Circuits +21

DNA-like interactions enhance the miscibility of supramolecular polymer blends

Shiao‐Wei Kuo, Ren-Shin Cheng · Polymer · 2008 · 37 citations

Dna Nanotechnology, Supramolecular Polymer Blends, Engineering +5

Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration

Ching-Kuan Lee, Tao‐Chih Chang, John H. Lau et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 32 citations

Engineering, Wafer Bumping, Interconnect (Integrated Circuits) +20

Reliable Microjoints Formed by Solid–Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture

Jing‐Yao Chang, Ren-Shin Cheng, Kuo‐Shu Kao et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 32 citations

Cu Pillar, Engineering, Mechanical Engineering +23

Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology

Tao‐Chih Chang, Chang‐Chun Lee, Chia-Ping Hsieh et al. · Microelectronics Reliability · 2015 · 21 citations

Electrical Characteristics, Electrical Engineering, Chip-scale Package +10