Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP

Abstract

In this study, a 3D IC integration system-in-package (SiP) with TSV/RDL/IPD interposer is designed and developed. Emphasis is placed on the Cu revealing, embedded stress sensors, non-destructive inspection, thermal modeling and measurement, and final assembly and reliability assessments.