Heng-Chieh Chien

Statistics

Publications

Citations

538

H-Index

Active since

2008

Affiliations

Industrial Technology Research Institute(Current)

ITRI International

National Tsing Hua University

National Taiwan University

Heng-Chieh Chien is an author at Industrial Technology Research Institute specializing in engineering, electrical engineering, and electronic packaging.

Top concepts

EngineeringElectronic PackagingElectrical EngineeringThermal EngineeringHeat TransferMicroelectronicsApplied Physics3D IntegrationComputer Engineering3D Printing

Publications per year

2008–2023

Publications

Thermal conductivity measurement and interface thermal resistance estimation using SiO2 thin film

Heng-Chieh Chien, Da‐Jeng Yao, Mei‐Jiau Huang et al. · Review of Scientific Instruments · 2008 · 89 citations

Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications

Heng-Chieh Chien, John H. Lau, Fang‐Lin Chao et al. · 2012 · 50 citations

Engineering, Computer Architecture, Ic Integration Sip +23

Thermal conductivity of Si/SiGe superlattice films

Chun-Kai Liu, Chih-Kuang Yu, Heng-Chieh Chien et al. · Journal of Applied Physics · 2008 · 49 citations

Materials Science, Layer Thickness, Engineering +12

Measurement and evaluation of the interfacial thermal resistance between a metal and a dielectric

Heng-Chieh Chien, Da‐Jeng Yao, Cheng‐Ting Hsu · Applied Physics Letters · 2008 · 47 citations

Engineering, Sandwiched Film Structure, Interfacial Thermal Resistance +19

Through-Silicon Hole Interposers for 3-D IC Integration

John H. Lau, Ching-Kuan Lee, Chau‐Jie Zhan et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 45 citations · Full text

Top Chip, Through-silicon Hole Interposers, Electrical Engineering +15

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