Ming-Ji Dai

Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications

Heng-Chieh Chien, John H. Lau, Fang‐Lin Chao et al. · 2012 · 50 citations

Engineering, Computer Architecture, Ic Integration Sip +23

Thermal conductivity of Si/SiGe superlattice films

Chun-Kai Liu, Chih-Kuang Yu, Heng-Chieh Chien et al. · Journal of Applied Physics · 2008 · 49 citations

Materials Science, Layer Thickness, Engineering +12

Through-Silicon Hole Interposers for 3-D IC Integration

John H. Lau, Ching-Kuan Lee, Chau‐Jie Zhan et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 45 citations · Full text

Top Chip, Through-silicon Hole Interposers, Electrical Engineering +15

Performance and Process Comparison between Glass and Si Interposer for 3D-IC Integration

Chun-Hsien Chien, Ching-Kuan Lee, Hsun Yu et al. · IMAPSource Proceedings · 2013 · 42 citations

Engineering, Device Integration, Process Comparison +19

Electro-thermal finite element analysis and verification of power module with aluminum wire

Li-Ling Liao, Tuan-Yu Hung, Chun-Kai Liu et al. · Microelectronic Engineering · 2014 · 31 citations

Electrical Engineering, Power Module, Engineering +4