Concepedia

Li-Ling Liao

LL

Statistics

Publications

5

Citations

178

H-Index

5

Active since

2013

Affiliations

Industrial Technology Research Institute(Current)

National Tsing Hua University

Li-Ling Liao is an author at Industrial Technology Research Institute specializing in electrical engineering, engineering, and electronic packaging.

Top concepts

EngineeringElectrical EngineeringElectronic Packaging3D IntegrationMicroelectronicsMicrofabricationComputer Engineering3D PrintingApplied PhysicsPlasticity

Publications per year

2013–2014

5

Publications

5

Life Prediction of High-Cycle Fatigue in Aluminum Bonding Wires Under Power Cycling Test

Tuan-Yu Hung, Li-Ling Liao, C. C. Wang et al. · IEEE Transactions on Device and Materials Reliability · 2014 · 47 citations

Engineering, Bonding Wire, Life Prediction +17

Through-Silicon Hole Interposers for 3-D IC Integration

John H. Lau, Ching-Kuan Lee, Chau‐Jie Zhan et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 45 citations · Full text

Top Chip, Through-silicon Hole Interposers, Electrical Engineering +15

Performance and Process Comparison between Glass and Si Interposer for 3D-IC Integration

Chun-Hsien Chien, Ching-Kuan Lee, Hsun Yu et al. · IMAPSource Proceedings · 2013 · 42 citations

Engineering, Device Integration, Process Comparison +19

Electro-thermal finite element analysis and verification of power module with aluminum wire

Li-Ling Liao, Tuan-Yu Hung, Chun-Kai Liu et al. · Microelectronic Engineering · 2014 · 31 citations

Electrical Engineering, Power Module, Engineering +4

Low-cost TSH (through-silicon hole) interposers for 3D IC integration

John H. Lau, Ching-Kuan Lee, Chau‐Jie Zhan et al. · 2014 · 13 citations

3D Ic Architecture, Electrical Engineering, Chip-scale Package +14

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