Yu‐Wei Huang

Deposition of diamond-like carbon films containing metal elements on biomedical Ti alloys

Da-Yung Wang, Yin‐Yu Chang, Chi-Lung Chang et al. · Surface and Coatings Technology · 2005 · 37 citations

Natural Sciences, Materials Engineering, Materials Science +13

Development of fluxless chip-on-wafer bonding process for 3DIC chip stacking with 30μm pitch lead-free solder micro bumps and reliability characterization

Chau‐Jie Zhan, Jing-Ye Juang, Yu-Min Lin et al. · 2011 · 36 citations

Engineering, Manufacturing Engineering, Microfabrication +14

Next-Generation High-Density PCB Development by Fan-Out RDL Technology

Meng-Kai Shih, Yu‐Wei Huang, Guan-Sian Lin · IEEE Transactions on Device and Materials Reliability · 2022 · 24 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17

Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP

Chau‐Jie Zhan, Pei-Jer Tzeng, John H. Lau et al. · 2012 · 21 citations

Engineering, Computer Engineering, Packaging Design +15

Effect of metal finishing fabricated by electro and Electroless plating process on reliability performance of 30μm-pitch solder micro bump interconnection

Jing-Ye Juang, Shin‐Yi Huang, Chau‐Jie Zhan et al. · 2013 · 20 citations

Engineering, Materials Engineering, Materials Science +15