Yu‐Wei Huang - Concepedia

Author

Yu‐Wei Huang

Industrial Technology Research Institute ORCID

Also Known As

Y W Huang, Y. Huang, Y. W. Huang, Yi‐Jia Huang, Yu-Wei Huang, Yu-wei Huang, Yu‐Wei Huang

Publications

275

Citations

H-Index

Concepts

All Affiliations

Industrial Technology Research Institute ITRI International

About

Yu‐Wei Huang is an author at Industrial Technology Research Institute specializing in engineering, microelectronics, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	8	8	186
2	Electrical Engineering	6	6	129
3	Computer Engineering	2	2	44
4	Applied Physics	1	1	19
5	Chemical Engineering	1	1	36

Yu‐Wei Huang

Publications

206

Citations

H-Index

Page 1

	Year	Citations
Deposition of diamond-like carbon films containing metal elements on biomedical Ti alloys Da-Yung Wang, Yin‐Yu Chang, Chi-Lung Chang, Surface and Coatings Technology Materials EngineeringMaterials ScienceChemical EngineeringDiamond-like Carbon FilmsEngineering	2005	36
Development of fluxless chip-on-wafer bonding process for 3DIC chip stacking with 30&#x03BC;m pitch lead-free solder micro bumps and reliability characterization Chau‐Jie Zhan, Jing-Ye Juang, Yu-Min Lin, Materials Science3D Ic ArchitectureElectrical EngineeringWafer Scale ProcessingEngineering	2011	36
Next-Generation High-Density PCB Development by Fan-Out RDL Technology Meng-Kai Shih, Yu‐Wei Huang, Guan-Sian Lin IEEE Transactions on Device and Materials Reliability Pcb ArchitectureEngineeringComputer-aided DesignIntegrated CircuitsInterconnect (Integrated Circuits)	2022	23
Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP Chau‐Jie Zhan, Pei-Jer Tzeng, John H. Lau, 3D Ic ArchitectureCu RevealingEngineeringIc Integration System-in-packageChip-scale Package	2012	21
Effect of metal finishing fabricated by electro and Electroless plating process on reliability performance of 30&#x03BC;m-pitch solder micro bump interconnection Jing-Ye Juang, Shin‐Yi Huang, Chau‐Jie Zhan, EngineeringMechanical EngineeringInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors)	2013	20
Study on flip chip assembly of high density micro-LED array Chao-Chyun An, Ming-Hsien Wu, Yu‐Wei Huang, Optical MaterialsEngineeringμLed ArrayOptoelectronic DevicesIntegrated Circuits	2011	19
Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging Pao-Hsiung Wang, Yu‐Wei Huang, Kuo‐Ning Chiang Micromachines EngineeringMechanical EngineeringReliability LifeFan-out Type 3DReliability Engineering	2021	16
Effects of UBM structure/material on the reliability performance of 3D chip stacking with 30&#x03BC;m-pitch solder micro bump interconnections Shin‐Yi Huang, Chau‐Jie Zhan, Yu‐Wei Huang, EngineeringMechanical EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)	2012	15
Development of high throughput adhesive bonding scheme by wafer-level underfill for 3D die-to-interposer stacking with 30µm-pitch micro interconnections Yu‐Wei Huang, Chia-Wen Fan, Yu-Min Lin,	2015	10
Concurrent concentration declines in groundwater-dissolved radon, methane and ethane precursory to 2011 MW 5.0 Chimei earthquake T. Kuo, Chen‐Wuing Liu, Chien‐Yuan Su, Radiation Measurements	2013	10

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