N. Kernevez - Concepedia

Author

N. Kernevez

Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Also Known As

N Kernevez, N. Kernevez, Nelly Kernevez

Publications

775

Citations

H-Index

Concepts

All Affiliations

Commissariat à l'Énergie Atomique et aux Énergies Alternatives CEA Grenoble Soitec (France)Laboratoire d'Électronique des Technologies de l'Information Direction de la Recherche Technologique

About

N. Kernevez is an author at Commissariat à l'Énergie Atomique et aux Énergies Alternatives specializing in engineering, applied physics, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	11	13	648
2	Applied Physics	11	12	604
3	Computer Engineering	2	2	132
4	Education	1	1	44
5	Medicine	1	1	26

N. Kernevez

Publications

730

Citations

H-Index

Page 1

	Year	Citations
Germanium-on-insulator (GeOI) substrates—A novel engineered substrate for future high performance devices T. Akatsu, C. Deguet, Loïc Sanchez, Materials Science in Semiconductor Processing Electronic DevicesEngineeringElectronic EngineeringSurface ScienceApplied Physics	2006	128
Engineering strained silicon on insulator wafers with the Smart CutTM technology B. Ghyselen, Jean‐Michel Hartmann, T. Ernst, Solid-State Electronics Insulator WafersSemiconductor TechnologyElectrical EngineeringEngineeringSilicon Debugging	2004	114
Challenges for 3D IC integration: bonding quality and thermal management Patrick Leduc, N. Sillon, Didier Louis, EngineeringBonding QualityDevice IntegrationIntegrated CircuitsInterconnect (Integrated Circuits)	2007	94
Transfers of 2-inch GaN films onto sapphire substrates using Smart Cut <sup>TM</sup> technology A. Tauzin, T. Akatsu, Marc Rabarot, Electronics Letters	2005	67
Fabrication and characterisation of 200 mm germanium-on-insulator (GeOI) substrates made from bulk germanium C. Deguet, L. Sanchez, T. Akatsu, Electronics Letters EngineeringSilicon On InsulatorRf SemiconductorMm Germanium-on-insulatorElectronic Packaging	2006	65
Description of a high sensitivity CW scalar DNP-NMR magnetometer N. Kernevez, H. Glenat IEEE Transactions on Magnetics MagnetismEarth Field NmrEngineeringPhysicsMeasurement	1991	44
InP dies transferred onto silicon substrate for optical interconnects application M. Kostrzewa, L. Di Cioccio, Marc Zussy, Sensors and Actuators A Physical PhotonicsElectrical EngineeringOptical MaterialsEngineeringAdvanced Packaging (Semiconductors)	2005	41
Germanium-On-Insulator (GeOI) structure realized by the Smart Cut™ technology F. Letertre, C. Deguet, C. Richtarch, MRS Proceedings Electrical EngineeringEngineeringTopological InsulatorApplied PhysicsTopological Material	2004	39
Three dimensional chip stacking using a wafer-to-wafer integration Ritwik Chatterjee, Marc Zussy, Antonio Roman, EngineeringDimensional ChipWafer Scale ProcessingAdvanced Packaging (Semiconductors)Precise Wafer-to-wafer Alignment	2007	38
Weak field NMR and ESR spectrometers and magnetometers N. Kernevez, D. Duret, M. Moussavi, IEEE Transactions on Magnetics EngineeringMagnetic ResonanceMagnetic Particle ImagingSpin ResonanceMagnetic Sensor	1992	26

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