N. Kernevez

Germanium-on-insulator (GeOI) substrates—A novel engineered substrate for future high performance devices

T. Akatsu, C. Deguet, Loïc Sanchez et al. · Materials Science in Semiconductor Processing · 2006 · 128 citations

Electronic Devices, Engineering, Electronic Engineering +5

Engineering strained silicon on insulator wafers with the Smart CutTM technology

B. Ghyselen, Jean‐Michel Hartmann, T. Ernst et al. · Solid-State Electronics · 2004 · 114 citations

Insulator Wafers, Semiconductor Technology, Electrical Engineering +8

Challenges for 3D IC integration: bonding quality and thermal management

Patrick Leduc, N. Sillon, Didier Louis et al. · 2007 · 94 citations

Engineering, Bonding Quality, Device Integration +21

Transfers of 2-inch GaN films onto sapphire substrates using Smart Cut ^TM technology

A. Tauzin, T. Akatsu, Marc Rabarot et al. · Electronics Letters · 2005 · 67 citations

Fabrication and characterisation of 200 mm germanium-on-insulator (GeOI) substrates made from bulk germanium

C. Deguet, L. Sanchez, T. Akatsu et al. · Electronics Letters · 2006 · 65 citations

Engineering, Silicon On Insulator, Rf Semiconductor +16