Scanning electron microscope measurement of width and shape of 10 nm patterned lines using a JMONSEL-modeled library

John S. Villarrubia, András Vládar, Bin Ming, +4

Ultramicroscopy

EngineeringElectron MicroscopyPhysicsMicrofabricationMicroscopy +11

Determining the shape and periodicity of nanostructures using small-angle X-ray scattering

Daniel F. Sunday, S. List, J. S. Chawla, +1

Journal of Applied Crystallography

X-ray CrystallographyX-ray SpectroscopyEngineeringElectron-beam LithographyMicroscopy +17

Air-gap formation during IMD deposition to lower interconnect capacitance

B.P. Shieh, Krishna C. Saraswat, J.P. McVittie, +4

IEEE Electron Device Letters

EngineeringMetal LinesChemical DepositionInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors) +14

Phase identification of self-forming Cu–Mn based diffusion barriers on p-SiOC:H and SiO2 dielectrics using x-ray absorption fine structure

J. M. Ablett, J. C. Woicik, Zs. Tôkei, +2

Applied Physics Letters

EngineeringSio2 DielectricsSolid-state ChemistryChemical EngineeringSelf-forming Cu–mn +15

Performance Comparison of Interconnect Technology and Architecture Options for Deep Submicron Technology Nodes

Mandeep Bamal, S. List, Michele Stucchi, +5

EngineeringDifferent MetricsEnergy EfficiencyComputer ArchitectureInterconnection Network Architecture +18

Experimental validation of crosstalk simulations for on-chip interconnects using S-parameters

M. Kobrinsky, S. Chakravarty, Dan Jiao, +3

IEEE Transactions on Advanced Packaging

EngineeringVlsi DesignComputer ArchitectureInterconnection Network ArchitectureCrosstalk Simulations +18

A novel technique for full-wave modeling of large-scale three-dimensional high-speed on/off-chip interconnect structures

Dan Jiao, Md. Mohiuddin Mazumder, S. Chakravarty, +4

EngineeringVlsi DesignInterconnect (Integrated Circuits)Electromagnetic CompatibilityPhysical Design (Electronics) +14

10nm three-dimensional CD-SEM metrology

András Vládar, John S. Villarrubia, J. S. Chawla, +4

Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

Porous Silica Xerogel Processing And Integration For Ulsi Applications

C. Jin, S. List, E. M. Zielinski

MRS Proceedings

Materials ScienceSol-gel SynthesisUlsi ApplicationsNanoporous Material

A global view of interconnects

S. List, Mandeep Bamal, Michele Stucchi, +1

Microelectronic Engineering

Global ViewNetwork ScienceEngineeringComputer EngineeringComputer Architecture +6