M. Kobrinsky

Three-dimensional wafer stacking via Cu-Cu bonding integrated with 65-nm strained-Si/low-k CMOS technology

P. Morrow, Choon-Ho Park, Shriram Ramanathan et al. · IEEE Electron Device Letters · 2006 · 166 citations

Materials Science, 3D Ic Architecture, Electrical Engineering +15

Comparisons of Conventional, 3-D, Optical, and RF Interconnects for On-Chip Clock Distribution

Kuan‐Neng Chen, M. Kobrinsky, B. C. Barnett et al. · IEEE Transactions on Electron Devices · 2004 · 83 citations

Engineering, Vlsi Design, Computer Architecture +17

Activation volume for inelastic deformation in polycrystalline Ag thin films

M. Kobrinsky, Carl V. Thompson · Acta Materialia · 2000 · 79 citations

Materials Science, Engineering, Severe Plastic Deformation +10

Effect of support compliance and residual stress on the shape of doubly supported surface-micromachined beams

M. Kobrinsky, Erik R. Deutsch, S.D. Senturia · Journal of Microelectromechanical Systems · 2000 · 68 citations

Engineering, Micromechanics, Mechanical Engineering +17

The thickness dependence of the flow stress of capped and uncapped polycrystalline Ag thin films

M. Kobrinsky, Carl V. Thompson · Applied Physics Letters · 1998 · 67 citations

Materials Science, Material Analysis, Thickness Dependence +13