Applied Physics Letters · 2009 · 50 citations · 15 references
EngineeringSio2 DielectricsSolid-state ChemistryChemical EngineeringSelf-forming Cu–mnSio2 SubstratesAlloy FilmEpitaxial GrowthFull CompletionMaterials ScienceMaterials EngineeringPhase IdentificationSemiconductor MaterialMicrostructureMaterial AnalysisDiffusion ResistanceSurface ScienceApplied PhysicsThin FilmsAmorphous Solid
X-ray absorption fine structure spectroscopy has been used to study the chemical and structural properties of self-forming diffusion barrier layers from Cu-8 at. % Mn alloy films on porous low-k and thermally grown SiO2 dielectrics. For the porous low-k/Cu(Mn) system, we provide evidence that the interface is composed of MnSiO3 and MnO with near complete Mn segregation from the alloy film; however, we find that the self-forming process does not go to full completion on thermally grown SiO2 substrates.
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A theoretical analysis of the oxidation of FeSi alloys
A. Atkinson · Corrosion Science · 1982 · 133 citations
On the use of alloying elements for Cu interconnect applications
Katayun Barmak, C. Cabral, K. P. Rodbell et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2006 · 119 citations
Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +18