K. P. Rodbell - Concepedia

Author

K. P. Rodbell

IBM (United States)

Also Known As

K. P. Rodbell, K. Rodbell, K.P. Rodbell

Publications

1.2K

Citations

H-Index

Concepts

All Affiliations

IBM (United States)IBM Research - Thomas J. Watson Research Center Rensselaer Polytechnic Institute

About

K. P. Rodbell is an author at IBM (United States) specializing in applied physics, engineering, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	14	17	1.1K
2	Applied Physics	14	17	1.1K
3	Natural Sciences	1	1	34
4	Chemical Engineering	1	1	17
5	Chemistry	1	1	11

K. P. Rodbell

Publications

1.1K

Citations

H-Index

Page 1

	Year	Citations
Copper Metallization for High Performance Silicon Technology R. Rosenberg, D. Edelstein, C.‐K. Hu, Annual Review of Materials Science EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Electronics IndustryWafer Scale Processing	2000	419
Microstructure control in semiconductor metallization J. M. E. Harper, K. P. Rodbell Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena Materials ScienceEpitaxial GrowthEngineeringSevere Plastic DeformationCrystalline Defects	1997	162
On the use of alloying elements for Cu interconnect applications Katayun Barmak, C. Cabral, K. P. Rodbell, Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena EngineeringMechanical EngineeringInterconnect (Integrated Circuits)Available Thin FilmCorrosion	2006	119
Detection of current-induced vacancies in thin aluminum–copper lines using positrons P. Asoka-Kumar, Kevin O’Brien, K. G. Lynn, Applied Physics Letters Semiconductor TechnologyElectrical EngineeringElectromigration TechniqueEngineeringCrystalline Defects	1996	100
Effect of a surface layer on the stress relaxation of thin films M.D. Thouless, K. P. Rodbell, C. Cabral Journal of Vacuum Science & Technology A Vacuum Surfaces and Films EngineeringSevere Plastic DeformationSurface LayerDislocation-glide MechanismsThin Film Process Technology	1996	64
The role of Cu distribution and Al2Cu precipitation on the electromigration reliability of submicrometer Al(Cu) lines E. G. Colgan, K. P. Rodbell Journal of Applied Physics Materials ScienceElectrical EngineeringElectromigration TechniqueEngineeringPatterned Lines	1994	42
Control of in-plane texture of body centered cubic metal thin films J. M. E. Harper, K. P. Rodbell, E. G. Colgan, Journal of Applied Physics Magnetic PropertiesEngineeringMechanical EngineeringMetal Thin FilmsThin Film Process Technology	1997	34
Texture inheritance in Al(Cu) interconnect materials Conal E. Murray, K. P. Rodbell Journal of Applied Physics Deposition Surface MorphologyAluminium NitrideEngineeringDeposition SurfaceChemical Deposition	2001	23
Cu segregation at the Al(Cu)/Al2O3 interface M. Copel, K. P. Rodbell, R. M. Tromp Applied Physics Letters Materials EngineeringMaterials ScienceAluminium NitrideElectromigration TechniqueSegregational Properties	1996	23
Texture Effects on the Electromigration Behavior of Layered Ti/AlCu/Ti Films K. P. Rodbell, D. B. Knorr, D. P. Tracy MRS Proceedings Materials EngineeringMaterials ScienceTexture EffectsElectromigration TechniqueEngineering	1992	19

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