K. P. Rodbell

Copper Metallization for High Performance Silicon Technology

R. Rosenberg, D. Edelstein, C.‐K. Hu et al. · Annual Review of Materials Science · 2000 · 419 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +18

Microstructure control in semiconductor metallization

J. M. E. Harper, K. P. Rodbell · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1997 · 162 citations

Materials Science, Epitaxial Growth, Engineering +15

On the use of alloying elements for Cu interconnect applications

Katayun Barmak, C. Cabral, K. P. Rodbell et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2006 · 119 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +18

Detection of current-induced vacancies in thin aluminum–copper lines using positrons

P. Asoka-Kumar, Kevin O’Brien, K. G. Lynn et al. · Applied Physics Letters · 1996 · 100 citations

Semiconductor Technology, Electrical Engineering, Electromigration Technique +13

Effect of a surface layer on the stress relaxation of thin films

M.D. Thouless, K. P. Rodbell, C. Cabral · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1996 · 64 citations

Engineering, Severe Plastic Deformation, Surface Layer +17