T. Enot

Challenges for 3D IC integration: bonding quality and thermal management

Patrick Leduc, N. Sillon, Didier Louis et al. · 2007 · 94 citations

Engineering, Bonding Quality, Device Integration +21

Through silicon vias technology for CMOS image sensors packaging

David Henry, F. Jacquet, M. Neyret et al. · 2008 · 75 citations

Backside Technology, 3D Ic Architecture, Electrical Engineering +12

Three dimensional chip stacking using a wafer-to-wafer integration

Ritwik Chatterjee, Marc Zussy, Antonio Roman et al. · 2007 · 38 citations

Engineering, Dimensional Chip, Wafer Scale Processing +16

Study of a silicon/glass bonded structure with a UV-curable adhesive for temporary bonding applications

Pierre Montméat, T. Enot, M. De Marco Dutra et al. · Microelectronic Engineering · 2017 · 21 citations

Materials Science, Uv-curable Adhesive, Engineering +7

Collective Die-to-Wafer Self-Assembly for High Alignment Accuracy and High Throughput 3D Integration

Alice Bond, Emilie Bourjot, S. Borel et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 19 citations

Engineering, Molecular Self-assembly, Die Assembly Throughput +26