Antonio Roman

Statistics

Publications

Citations

124

H-Index

Active since

2007

Affiliations

Laboratoire d'Électronique des Technologies de l'Information(Current)

Commissariat à l'Énergie Atomique et aux Énergies Alternatives

CEA Grenoble

Université Grenoble Alpes

Antonio Roman is an author at Laboratoire d'Électronique des Technologies de l'Information specializing in wafer bonding, interconnect technology, and engineering.

Publications per year

2007–2024

Publications

Enabling technologies for 3D chip stacking

Patrick Leduc, L. Di Cioccio, Barbara Charlet et al. · 2008 · 48 citations

Engineering, Electrical Engineering, Microelectronics +16

Three dimensional chip stacking using a wafer-to-wafer integration

Ritwik Chatterjee, Marc Zussy, Antonio Roman et al. · 2007 · 38 citations

Engineering, Electrical Engineering, Materials Science +17

Enabling 3D Monolithic Integration

P. Batude, M. Vinet, A. Pouydebasque et al. · ECS Transactions · 2008 · 23 citations

Engineering, Electrical Engineering, Materials Engineering +17

3-layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator With High Density TSV For Advanced CMOS Image Sensor Applications

Stéphane Nicolas, Jerzy-Javier Suarez-Berru, N. Bresson et al. · 2024 · 15 citations

Engineering, Materials Engineering, Materials Science +17

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