Semiconductor Science and Technology · 2021 · 17 citations · 18 references
EngineeringElectrical EngineeringPhysicsElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsDevice ModelingElectronic Transport ModelingSemiconductor PhysicsSemiconductor ReliabilityTransient AnalysisTransient ResponseActivation EnergyArrhenius EquationCarrier RelaxationCarrier Relaxation DynamicsGallium Nitride (Gan) MaterialsJunction TransientsNumerical ModellingTransient Device Modeling
Abstract In this paper, we investigate the influence of Poole–Frenkel effect (PFE) on the dynamic R ON transients in C-doped p-GaN HEMTs. To this aim, we perform a characterization of the dynamic R ON transients acquired during OFF-state stress (i.e. V GS,STR = 0 V < V T , V DS,STR = 25–125 V) and we interpret the results with the aid of numerical simulations. We find that dynamic R ON transients at room temperature accelerate with V DS,STR 1/2 , which is signature of PFE, as further confirmed by the simultaneous decrease of the activation energy ( E A ) extracted from the Arrhenius plot of the dynamic R ON transients at V DS,STR = 50 V and T = 30 °C–110 °C. Results obtained by means of calibrated numerical simulations reproduce the exponential dependence of transients time constants ( τ ) on V DS,STR 1/2 and consequent E A reduction only when including the PFE-enhancement model of hole emission from dominant acceptor traps in the buffer related to C doping. This result is consistent with the ‘hole-redistribution’ model that considers hole emission from acceptor traps (rather than electron capture) as the mechanism underlying dynamic R ON increase during OFF-state stress.
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GaN-based power devices: Physics, reliability, and perspectives
Matteo Meneghini, Carlo De Santi, Idriss Abid et al. · Journal of Applied Physics · 2021 · 628 citations · Full text
Davide Bisi, Matteo Meneghini, Carlo De Santi et al. · IEEE Transactions on Electron Devices · 2013 · 443 citations · Full text