Simplistic approach to reduce thermal issues in 3D IC integration technology

3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration

Kaustav Banerjee, S.J. Souri, Pawan Kapur et al. · Proceedings of the IEEE · 2001 · 1K citations

Engineering, Vlsi Design, Device Integration +22

Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs

Robert Patti · Proceedings of the IEEE · 2006 · 589 citations

Engineering, Computer Architecture, Integrated Circuits +19

Bridging the Processor-Memory Performance Gapwith 3D IC Technology

C.C. Liu, Ilya Ganusov, Martin Burtscher et al. · IEEE Design & Test of Computers · 2005 · 280 citations

Hardware Security, 3D Ic Architecture, Manycore Processor +15

Thermal management of 3D IC integration with TSV (through silicon via)

John H. Lau, Tang Gong Yue · 2009 · 183 citations

Engineering, Stacked Tsv, Advanced Packaging (Semiconductors) +19

Morphology and Bond Strength of Copper Wafer Bonding

Kuan‐Neng Chen, Chuan Seng Tan, Andy Fan et al. · Electrochemical and Solid-State Letters · 2003 · 163 citations

Materials Engineering, Materials Science, Electromigration Technique +14