C.C. Liu

Bridging the Processor-Memory Performance Gapwith 3D IC Technology

C.C. Liu, Ilya Ganusov, Martin Burtscher et al. · IEEE Design & Test of Computers · 2005 · 280 citations

Hardware Security, 3D Ic Architecture, Manycore Processor +15

Three-dimensional integration: technology, use, and issues for mixed-signal applications

Lei Xue, C.C. Liu, Hong-Seung Kim et al. · IEEE Transactions on Electron Devices · 2003 · 71 citations

Engineering, Device Integration, Computer-aided Design +22

Heating effects of clock drivers in bulk, SOI, and 3-D CMOS

C.C. Liu, Jifeng Zhang, Ashim K. Datta et al. · IEEE Electron Device Letters · 2002 · 32 citations

Engineering, Vlsi Design, Computer Architecture +21

Crosstalk Reduction in Mixed-Signal 3-D Integrated Circuits With Interdevice Layer Ground Planes

S.K. Kim, C.C. Liu, Lei Xue et al. · IEEE Transactions on Electron Devices · 2005 · 21 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +16

Mapping System-on-Chip Designs from 2-D to 3-D ICs

C.C. Liu, Jeng-Huei Chen, Rajit Manohar et al. · 2005 · 15 citations

Engineering, Computer Architecture, Computer-aided Design +18