Joint reliability of various Pb-free solders under harsh vibration conditions for automotive electronics

The Changing Automotive Environment: High-Temperature Electronics

Wayne Johnson, John L. Evans, Peter Jacobsen et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2004 · 854 citations

Engineering, Automotive Engineering, Electrical Engineering +17

A review: On the development of low melting temperature Pb-free solders

Hiren R. Kotadia, Philip D. Howes, S.H. Mannan · Microelectronics Reliability · 2014 · 465 citations

Natural Sciences, Materials Engineering, Materials Science +11

Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni

Cheng–En Ho, Rung‐Ywan Tsai, Y. L. Lin et al. · Journal of Electronic Materials · 2002 · 325 citations

Natural Sciences, Materials Engineering, Materials Science +13

Ductile-to-brittle transition in Sn–Zn solder joints measured by impact test

Munehiro Date, T. Shoji, M. Fujiyoshi et al. · Scripta Materialia · 2004 · 162 citations

Natural Sciences, Materials Engineering, Materials Science +16

High-cycle fatigue life prediction for Pb-free BGA under random vibration loading

Da Yu, Abdullah Al-Yafawi, Tung Nguyen et al. · Microelectronics Reliability · 2010 · 150 citations

Engineering, Materials Engineering, Materials Science +16