Ductile-to-brittle transition in Sn–Zn solder joints measured by impact test

Thermodynamic prediction of interface phases at Cu/solder joints

Hyuck Mo Lee, Seung Wook Yoon, Byeong‐Joo Lee · Journal of Electronic Materials · 1998 · 96 citations

Natural Sciences, Materials Engineering, Materials Science +16

Effects of process parameters on the soldering behavior of the eutectic Sn-Zn solder on Cu substrate

Shan-Pu Yu, Hsiu‐Ju Lin, Min‐Hsiung Hon et al. · Journal of Materials Science Materials in Electronics · 2000 · 75 citations

Natural Sciences, Materials Engineering, Materials Science +13

Intermetallic Compounds Formed during the Soldering Reactions of Eutectic Sn-9Zn with Cu and Ni Substrates

Yin‐Ching Chan, M. Y. Chiu, Tung‐Han Chuang · Zeitschrift für Metallkunde · 2002 · 40 citations

Natural Sciences, Materials Engineering, Materials Science +17

Mechanical Strength and Microstructure of BGA Joints Using Lead-Free Solders

Masataka Nishiura, Akihiro Nakayama, S. Sakatani et al. · MATERIALS TRANSACTIONS · 2002 · 36 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +12