Junghwan Bang - Concepedia

Author

Junghwan Bang

Korea Institute of Industrial Technology ORCID

Also Known As

Bang Junghwan, Jongsik Kim, Jung-Hwan Bang, JungHwan Bang, Junghwan Bang

Publications

588

Citations

H-Index

Concepts

All Affiliations

Korea Institute of Industrial Technology Korea Advanced Institute of Science and Technology Korea University of Science and Technology The University of Osaka Korea University

About

Junghwan Bang is an author at Korea Institute of Industrial Technology specializing in engineering, materials science, and materials engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	12	14	365
2	Applied Physics	5	5	122
3	Electrical Engineering	5	5	71
4	Chemistry	4	4	130
5	Chemical Engineering	1	1	12

Junghwan Bang

Publications

451

Citations

H-Index

Page 1

	Year	Citations
Interfacial reaction and intermetallic compound formation of Sn–1Ag/ENIG and Sn–1Ag/ENEPIG solder joints Jeong‐Won Yoon, Junghwan Bang, Chang‐Woo Lee, Journal of Alloys and Compounds Materials ScienceInterfacial ReactionEngineeringIntermetallic Compound FormationMechanical Engineering	2014	53
Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate Ming Yang, Yong-Ho Ko, Junghwan Bang, Materials Characterization Materials EngineeringMaterials ScienceEngineeringAg AdditionSurface Science	2017	51
Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications Byung‐Suk Lee, Yong-Ho Ko, Junghwan Bang, Microelectronics Reliability Materials ScienceMaterials EngineeringInterfacial ReactionsFriction WeldingEngineering	2017	44
Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates Ming Yang, Yong-Ho Ko, Junghwan Bang, Journal of Alloys and Compounds Materials ScienceMaterials EngineeringEngineeringCorrosionSurface Science	2017	34
Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate Junghwan Bang, Dong-Yurl Yu, Yong-Ho Ko, Microelectronics Reliability Materials ScienceMaterials EngineeringEngineeringCorrosionSurface Science	2019	28
Effect of Cu/Fe addition on the microstructures and electrical performances of Ni–Co–Mn oxides Jae-Eun Jeon, Kyoung Ryeol Park, Kang Min Kim, Journal of Alloys and Compounds Materials EngineeringMaterials ScienceEngineeringOxide ElectronicsNi–co–mn Oxides	2020	28
Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint Junghwan Bang, Dong-Yurl Yu, Yong-Ho Ko, Journal of Alloys and Compounds Materials EngineeringMaterials ScienceEngineeringCorrosionIntermetallic Compound Formation	2017	25
Power Module Packaging Technology with Extended Reliability for Electric Vehicle Applications Jeong-Won Yoon, Junghwan Bang, Yong-Ho Ko, Journal of the Microelectronics and Packaging Society	2014	22
Joint reliability of various Pb-free solders under harsh vibration conditions for automotive electronics Kyeonggon Choi, Dong-Youl Yu, Sungdo Ahn, Microelectronics Reliability Electrical EngineeringEngineeringHardware ReliabilityVarious Pb-free SoldersJoint Reliability	2018	22
Interfacial reactions of fine-pitch Cu/Sn–3.5Ag pillar joints on Cu/Zn and Cu/Ni under bump metallurgies Mi-Song Kim, Myoung-Seok Kang, Junghwan Bang, Journal of Alloys and Compounds Materials EngineeringInterfacial ReactionsMaterials ScienceEngineeringSurface Science	2014	17

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