Concepedia

Junghwan Bang

JB

20

Publications

451

Citations

14

H-Index

2014

Active since

Affiliations

Korea Institute of Industrial Technology(Current)

Korea Advanced Institute of Science and Technology

Korea University of Science and Technology

The University of Osaka

Korea University

Junghwan Bang is an author at Korea Institute of Industrial Technology specializing in engineering, materials science, and materials engineering.

ORCID

Top concepts

Publications per year

2014–2023

20

Publications

20

Interfacial reaction and intermetallic compound formation of Sn–1Ag/ENIG and Sn–1Ag/ENEPIG solder joints

Jeong‐Won Yoon, Junghwan Bang, Chang‐Woo Lee et al. · Journal of Alloys and Compounds · 2014 · 53 citations

, , +3

Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

Ming Yang, Yong-Ho Ko, Junghwan Bang et al. · Materials Characterization · 2017 · 51 citations

, , +8

Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications

Byung‐Suk Lee, Yong-Ho Ko, Junghwan Bang et al. · Microelectronics Reliability · 2017 · 44 citations

, , +11

Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates

Ming Yang, Yong-Ho Ko, Junghwan Bang et al. · Journal of Alloys and Compounds · 2017 · 34 citations

, , +9

Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate

Junghwan Bang, Dong-Yurl Yu, Yong-Ho Ko et al. · Microelectronics Reliability · 2019 · 28 citations

, , +10

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