Publication | Closed Access
Interfacial reaction and intermetallic compound formation of Sn–1Ag/ENIG and Sn–1Ag/ENEPIG solder joints
53
Citations
22
References
2014
Year
Materials ScienceInterfacial ReactionEngineeringIntermetallic Compound FormationMechanical EngineeringSn–1ag/enepig Solder Joints
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