Byung‐Suk Lee

Cu–Sn and Ni–Sn transient liquid phase bonding for die-attach technology applications in high-temperature power electronics packaging

Byung‐Suk Lee, Soong‐Keun Hyun, Jeong‐Won Yoon · Journal of Materials Science Materials in Electronics · 2017 · 83 citations

Engineering, Materials Engineering, Materials Science +16

Die-attach for power devices using the Ag sintering process: Interfacial microstructure and mechanical strength

Byung‐Suk Lee, Jeong‐Won Yoon · Metals and Materials International · 2017 · 50 citations

Engineering, Materials Engineering, Materials Science +14

Cu-Sn Intermetallic Compound Joints for High-Temperature Power Electronics Applications

Byung‐Suk Lee, Jeong‐Won Yoon · Journal of Electronic Materials · 2017 · 50 citations

Natural Sciences, Materials Engineering, Materials Science +10

Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications

Byung‐Suk Lee, Yong-Ho Ko, Junghwan Bang et al. · Microelectronics Reliability · 2017 · 44 citations

Natural Sciences, Materials Engineering, Materials Science +16

Bonding of power device to ceramic substrate using Sn-coated Cu micro paste for high-temperature applications

Soyoung Bae, Byung‐Suk Lee, Seung‐Boo Jung · Applied Surface Science · 2020 · 41 citations

Natural Sciences, Materials Engineering, Materials Science +9