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Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications

Materials ScienceMaterials EngineeringInterfacial ReactionsFriction WeldingEngineeringPower Electronics ApplicationsCorrosionMechanical EngineeringApplied PhysicsMetallurgical InteractionMechanical StrengthElectronic PackagingMicrostructureMetal Processing