Sehoon Yoo

Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications

Byung‐Suk Lee, Yong-Ho Ko, Junghwan Bang et al. · Microelectronics Reliability · 2017 · 44 citations

Materials Science, Materials Engineering, Interfacial Reactions +11

Effect of Si content on surface hardening of Al–Si alloy by shot peening treatment

K.T. Cho, Sehoon Yoo, Kyoung-Mook Lim et al. · Journal of Alloys and Compounds · 2011 · 38 citations

Materials Engineering, Materials Science, Surface Hardening +9

High-speed TSV filling with molten solder

Young-Ki Ko, H. Fujii, Yutaka S. Sato et al. · Microelectronic Engineering · 2011 · 34 citations

Engineering, Powder Metallurgy, High-speed Tsv +3

Effects of surface finishes and loading speeds on shear strength of Sn–3.0Ag–0.5Cu solder joints

Jae-Myeong Kim, Myeong-Hyeok Jeong, Sehoon Yoo et al. · Microelectronic Engineering · 2011 · 32 citations

Materials Science, Friction Welding, Engineering +8

Power Module Packaging Technology with Extended Reliability for Electric Vehicle Applications

Jeong-Won Yoon, Junghwan Bang, Yong-Ho Ko et al. · Journal of the Microelectronics and Packaging Society · 2014 · 22 citations · Full text