Yong-Ho Ko - Concepedia

Author

Yong-Ho Ko

Korea Institute of Industrial Technology ORCID

Also Known As

Ko, Yongho, Y. H. Ko, Y.H. Ko, Yong-Ho Ko, Yongho Ko

Publications

819

Citations

H-Index

Concepts

All Affiliations

Korea Institute of Industrial Technology Korea Advanced Institute of Science and Technology Harbin Institute of Technology Hanyang University The University of Osaka

About

Yong-Ho Ko is an author at Korea Institute of Industrial Technology specializing in materials science, engineering, and microstructure.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	15	18	656
2	Applied Physics	6	6	237
3	Chemistry	5	5	242
4	Electrical Engineering	5	5	178
5	Chemical Engineering	1	1	16

Yong-Ho Ko

Publications

693

Citations

H-Index

Page 1

	Year	Citations
Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering Ming Yang, Hongjun Ji, Shuai Wang, Journal of Alloys and Compounds Materials ScienceInterfacial ReactionsAg ContentEngineeringSurface Science	2016	113
Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad Y. K. Jee, Yong-Ho Ko, Jin Yu Journal of materials research/Pratt's guide to venture capital sources Materials EngineeringMaterials ScienceElectrical EngineeringEngineeringPowder Metallurgy	2007	72
Facile and highly efficient fabrication of robust Ag nanowire–elastomer composite electrodes with tailored electrical properties Ming Yang, Sang‐Woo Kim, Shuye Zhang, Journal of Materials Chemistry C Materials Science3-D MaskElectrical EngineeringElectroactive MaterialEngineering	2018	57
Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate Ming Yang, Yong-Ho Ko, Junghwan Bang, Materials Characterization Materials EngineeringMaterials ScienceEngineeringAg AdditionSurface Science	2017	51
Laser-engineered oxygen vacancies for improving the NO<sub>2</sub> sensing performance of SnO<sub>2</sub> nanowires Yong Jung Kwon, Hyoun Woo Kim, Woo Chul Ko, Journal of Materials Chemistry A Materials ScienceNanoscale SystemOxygen VacanciesEngineeringLaser Photochemistry	2019	49
Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene Yong-Ho Ko, Jong‐Dae Lee, Taeshik Yoon, ACS Applied Materials & Interfaces Materials ScienceInterfacial ReactionsImmoderate GrowthSolder MetalImc Growth	2016	48
Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications Byung‐Suk Lee, Yong-Ho Ko, Junghwan Bang, Microelectronics Reliability Materials ScienceMaterials EngineeringInterfacial ReactionsFriction WeldingEngineering	2017	44
Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates Ming Yang, Yong-Ho Ko, Junghwan Bang, Journal of Alloys and Compounds Materials ScienceMaterials EngineeringEngineeringCorrosionSurface Science	2017	34
Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate Junghwan Bang, Dong-Yurl Yu, Yong-Ho Ko, Microelectronics Reliability Materials ScienceMaterials EngineeringEngineeringCorrosionSurface Science	2019	28
Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint Junghwan Bang, Dong-Yurl Yu, Yong-Ho Ko, Journal of Alloys and Compounds Materials EngineeringMaterials ScienceEngineeringCorrosionIntermetallic Compound Formation	2017	25

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