Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad

Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability

Kejun Zeng, R.J. Stierman, Tz-Cheng Chiu et al. · Journal of Applied Physics · 2004 · 437 citations

Natural Sciences, Materials Engineering, Materials Science +16

Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni

Cheng–En Ho, Rung‐Ywan Tsai, Y. L. Lin et al. · Journal of Electronic Materials · 2002 · 325 citations

Natural Sciences, Materials Engineering, Materials Science +13

Effect of thermal aging on board level drop reliability for Pb-free BGA packages

Tz-Cheng Chiu, Kejun Zeng, R.J. Stierman et al. · 2004 · 248 citations

Engineering, Materials Engineering, Materials Science +17

Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders

H. Mavoori, Jason Chin, Semyon Vaynman et al. · Journal of Electronic Materials · 1997 · 235 citations

Natural Sciences, Materials Engineering, Materials Science +16

Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders

S. K. Kang, S. Purushothaman · Journal of Electronic Materials · 1996 · 162 citations

Natural Sciences, Materials Engineering, Materials Science +12