Publication | Closed Access
Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad
72
Citations
26
References
2007
Year
Materials EngineeringMaterials ScienceElectrical EngineeringEngineeringPowder MetallurgyCorrosionSn-3.5ag SolderIntermetallics FormationMetallurgical ProcessElectronic PackagingMetal FormingHigh-performance MetalMicrostructureMetal ProcessingCu Pad
| Year | Citations | |
|---|---|---|
Page 1
Page 1