Hongjun Ji - Concepedia

Author

Hongjun Ji

Harbin Institute of Technology ORCID

Also Known As

H Ji, H. Ji, Hong Jun Ji, Hongjun Ji

178

Publications

4.1K

Citations

H-Index

Concepts

All Affiliations

Harbin Institute of Technology University Town of Shenzhen Shenzhen University Shenzhen Institute of Information Technology Nanjing University of Science and Technology

About

Hongjun Ji is an author at Harbin Institute of Technology specializing in engineering, materials science, and mechanical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	30	60	3.4K
2	Applied Physics	19	24	1.9K
3	Chemical Engineering	7	7	378
4	Natural Sciences	2	2	26
5	Biomedical Engineering	2	2	128

Hongjun Ji

Publications

3.8K

Citations

H-Index

Page 1

	Year	Citations
Ultrafast control of vortex microlasers Can Huang, Chen Zhang, Shumin Xiao, Science Thz PhotonicsQuantum PhotonicsEngineeringIntegrated PhotonicsOptomechanics	2020	784
Highly Conductive Cu–Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles Jingdong Liu, Hongtao Chen, Hongjun Ji, ACS Applied Materials & Interfaces Low-temperature SinteringEngineeringMetal NanoparticlesMechanical EngineeringChemistry	2016	215
Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging Shuai Wang, Mingyu Li, Hongjun Ji, Scripta Materialia Materials ScienceSinteringEngineeringNanomaterialsNanotechnology	2013	168
Low-temperature sintering of Ag nanoparticles for high-performance thermoelectric module design Li Yin, Fan Yang, Xin Bao, Nature Energy Materials ScienceElectrical EngineeringSinteringEngineeringNanomaterials	2023	163
Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering Ming Yang, Hongjun Ji, Shuai Wang, Journal of Alloys and Compounds Materials ScienceInterfacial ReactionsAg ContentEngineeringSurface Science	2016	113
Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application Hongjun Ji, Yunfei Qiao, Mingyu Li Scripta Materialia Advanced PackagingMaterials ScienceRapid FormationEngineeringAdvanced Packaging (Semiconductors)	2015	103
Wearable Circuits Sintered at Room Temperature Directly on the Skin Surface for Health Monitoring Ling Zhang, Hongjun Ji, Houbing Huang, ACS Applied Materials & Interfaces Wearable SystemSmart TextileEngineeringMechanical EngineeringWearable Technology	2020	92
Ultra-low temperature sintering of Cu@Ag core-shell nanoparticle paste by ultrasonic in air for high-temperature power device packaging Hongjun Ji, Junbo Zhou, Meng Liang, Ultrasonics Sonochemistry Materials ScienceSinteringPowder MetallurgyUltra-low Temperature SinteringNanomaterials	2017	90
Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn–3Al filler metal Yong Xiao, Hongjun Ji, Mingyu Li, Materials & Design (1980-2015) Materials ScienceEngineeringMechanical EngineeringMetallurgical InteractionMetallurgical Process	2013	89
Fabrication of interconnects using pressureless low temperature sintered Ag nanoparticles Shuai Wang, Hongjun Ji, Mingyu Li, Materials Letters Materials ScienceSinteringEngineeringMetal NanoparticlesNanomaterials	2012	81

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