Publication | Closed Access
Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate
51
Citations
32
References
2017
Year
Materials EngineeringMaterials ScienceEngineeringAg AdditionSurface ScienceMetallurgical InteractionMetallurgical ProcessChemistrySolid–state Interfacial ReactionsSn–ag–cu SolderMetal Processing
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