High-speed TSV filling with molten solder

Copper plating for 3D interconnects

Aleksandar Radisic, Ole Lühn, Harold Philipsen et al. · Microelectronic Engineering · 2010 · 82 citations

Natural Sciences, Materials Engineering, Materials Science +8

Development of three-dimensional chip stacking technology using a clamped through-silicon via interconnection

Li‐Cheng Shen, Chien-Wei Chien, Hsien‐Chie Cheng et al. · Microelectronics Reliability · 2009 · 61 citations

Engineering, Computer Engineering, Electrical Engineering +14

Zinc and Tin-Zinc Via-Filling for the Formation of Through-Silicon Vias in a System-in-Package

Y. K. Jee, Jin Yu, K. W. Park et al. · Journal of Electronic Materials · 2009 · 35 citations

Engineering, Materials Engineering, Materials Science +14

3D Integration-Present and Future

Tom Jiang, Shijian Luo · 2008 · 33 citations

Engineering, Electrical Engineering, Materials Engineering +17

Bottom-up copper electroplating using transfer wafers for fabrication of high aspect-ratio through-silicon-vias

Chongshen Song, Zheyao Wang, Litian Liu · Microelectronic Engineering · 2009 · 32 citations

Engineering, Materials Engineering, Materials Science +14