Concepedia

Chien-Wei Chien

CC

Statistics

Publications

3

Citations

89

H-Index

3

Active since

2005

Affiliations

Feng Chia University(Current)

Industrial Technology Research Institute

Chien-Wei Chien is an author at Feng Chia University specializing in microfabrication, electronic packaging, and computer engineering.

Top concepts

EngineeringMicroelectronicsMicrofabricationComputer EngineeringElectronic PackagingElectrical Engineering3D PrintingTechnologyApplied PhysicsNanoelectronics

Publications per year

2005–2009

3

Publications

3

Development of three-dimensional chip stacking technology using a clamped through-silicon via interconnection

Li‐Cheng Shen, Chien-Wei Chien, Hsien‐Chie Cheng et al. · Microelectronics Reliability · 2009 · 61 citations

Three-dimensional Chip, 3D Ic Architecture, Electrical Engineering +12

Development and characterization of low cost ultrathin 3D interconnect

Wei‐Chung Lo, Yuhua Chen, Jeng-Dar Ko et al. · 2005 · 18 citations

3D Ic Architecture, Electrical Engineering, Economic Criteria +14

A clamped through silicon via (TSV) interconnection for stacked chip bonding using metal cap on pad and metal column forming in via

Li‐Cheng Shen, Chien-Wei Chien, Jin-Ye Jaung et al. · 2008 · 10 citations

3D Ic Architecture, Electrical Engineering, Chip-scale Package +15

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