Statistics
Publications
5
Citations
165
H-Index
5
Active since
2004
Affiliations
Micron (United States)(Current)
Tom Jiang is an author at Micron (United States) specializing in materials science, chip packaging, and electronic materials.
Publications per year
2004–2008
5
5
Reliability of Cu Wire Bonding to Al Metallization
Luke England, Tom Jiang · 2007 · 56 citations
Natural Sciences, Materials Engineering, Materials Science +16
3D Integration-Present and Future
Tom Jiang, Shijian Luo · 2008 · 33 citations
Engineering, Electrical Engineering, Materials Engineering +17
Experimental investigation of bare silicon wafer warp
N.R. Draney, Jun Jun Liu, Tom Jiang · 2004 · 28 citations
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