2011 · 15 citations · 7 references
EngineeringElectrical EngineeringElectronic MaterialsMicroelectronicsSemiconductor DevicesField-effect TransistorsIntegrated Circuit DesignMetal-oxide-semiconductor Field-effect TransistorsShort-channel EffectsCarrier ConcentrationDual-gate Field-effect TransistorsFabricationFin Field-effect TransistorsGate LeakageGate Leakage CurrentGate Oxide LeakageLeakage Current
In view of difficulties of the planar MOSFET technology to get the acceptable gate control over the channel FinFET technology based on multiple gate devices is better technology option for further shrinking the size of the planar MOSFET [1]. For double gate SOI- MOSFET the gates control the channel created between source and drain terminal effectively. So the several short channel effects like DIBL, subthreshold swing, gate leakage current etc. without increasing the carrier concentration into the channel. This paper mainly deals with detail description about the DG MOSFET structure and its particular type named as FinFET technology and its fabrication mechanism is also described. Below the 50nm technology FinFET has better controlling over the several short channel effects. In section one the introduction is given, section two describe the
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FinFET-a self-aligned double-gate MOSFET scalable to 20 nm
Chenming Hu, Jeffrey Bokor, Tsu‐Jae King et al. · IEEE Transactions on Electron Devices · 2000 · 1.6K citations
Engineering, Electrical Engineering, Electronic Materials +13
FinFET scaling to 10 nm gate length
Bin Yu, Leland Chang, Safayet Ahmed et al. · 2003 · 595 citations
M. Jurczak, Nadine Collaert, A. Veloso et al. · 2009 · 164 citations