IEEE Transactions on Power Electronics · 2006 · 14 citations · 17 references
EngineeringElectrical EngineeringMicroelectronicsPower ElectronicsSemiconductor DevicesBipolar Junction TransistorsDevice CharacterizationDevice ModelingDevice SimulationSemiconductor PhysicsSemiconductor ReliabilityAnalytical ModelsBipolar Junction Transistor ModelingCompact Device ModelingFinite Element Device SimulationInsulated-gate Field-effect TransistorsMetal-oxide-semiconductor Field-effect Transistor ModelingPower Device SimulationSemiconductor Technology
While there are several analytical models dedicated to vertical insulated gate bipolar transistors (IGBTs) there is virtually no reliable model for lateral IGBTs (LIGBTs). LIGBTs are increasingly popular in smart power and power integrated circuits, especially in those applications where high voltage (e.g., 600 V) and high current capability (e.g., 30 A/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> ) are required. In this paper, we report for the first time a complete analytical model for the LIGBT based on semiconductor physics with very few fitting parameters. The model is implemented in the widely available circuit simulator PSpice. The model consistently describes the current and voltage waveforms for all loading conditions. The model is assessed against finite element device simulations and experimental results
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The COMFET—A new high conductance MOS-gated device
John P. Russell, Alvin M. Goodman, L.A. Goodman et al. · IEEE Electron Device Letters · 1983 · 201 citations