IEEE Electron Device Letters · 1996 · 24 citations · 5 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsMicroelectronicsSemiconductor DevicesComplementary Metal-oxide-semiconductor TechnologyHigh-frequency Semiconductor DevicesIii-v SemiconductorsRadio-frequency Integrated CircuitsWide-bandgap Semiconductor DevicesContact ResistanceElectrical Contact ResistanceHigh-electron-mobility TransistorsHigh-frequency ElectronicsHigh-frequency PerformanceOhmic ContactsTransconductanceTransconductance Amplifiers
This letter reports DC and RF performance of 0.25 μm gatelength GaInAs/InP composite channel HEMT's with nonalloyed, regrown ohmic contacts by MOCVD. Regrown channel contacts are used to achieve low contact resistance (0.35 /spl Omega/-mm) to (50 /spl Aring/) GaInAs/(150 /spl Aring/) InP composite channel HEMT's. High transconductance (600 mS/mm), high full channel current (650 mA/mm), and high peak cut-off frequencies (F <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</sub> =70 GHz, F <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">max</sub> =170 GHz) are observed. Contact transfer resistance of regrown channel contacts is compared to conventional alloyed contacts for varying GaInAs/InP channel composition.
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InGaAs/InP double channel HEMT on InP
T. Enoki, Kunihiro Arai, A. Kohzen et al. · 2003 · 38 citations
K-band GaInAs/InP channel power HEMTs
M. Matloubian, T. Liu, L.M. Jelloian et al. · Electronics Letters · 1995 · 22 citations