2010 · 44 citations · 6 references
EngineeringElectrical EngineeringElectronic MaterialsMicroelectronicsVlsi DesignDevice CharacterizationDevice ModelingHigh-frequency Semiconductor DevicesIntegrated Circuit DesignRadio-frequency Integrated CircuitsBottleneck DetectionBottleneck QuantificationFin Field-effect TransistorsParasitic CapacitanceParasitic EffectsParasitic Element ModelingParasitic ElementsParasitic Extraction
In this work, the high frequency (RF) performance of FinFETs is investigated in detail using a two-level parasitic model comprising outer and inner parasitic capacitances in addition to parasitic series resistances. Use of scaling relations of these parasitic capacitances with numbers of fins and fingers allows extraction of these elements. Next, by defining a series of reference surfaces, each associated with a certain set of parasitic elements, we proceed to calculate the RF Figures of Merit, namely fT and fmax at these surfaces. These are called ‘available fT (fmax)’ in this work. Analysis of the available fT (fmax) gives insight into the extent to which different parasitics affect the FinFET’s RF performance. The main bottleneck to the FinFET’s RF performance is identified, solutions are proposed and relevant trade-offs are discussed.
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FinFET-a self-aligned double-gate MOSFET scalable to 20 nm
Chenming Hu, Jeffrey Bokor, Tsu‐Jae King et al. · IEEE Transactions on Electron Devices · 2000 · 1.6K citations
Engineering, Electrical Engineering, Electronic Materials +13
Dependence of FinFET RF performance on fin width
Dimitri Lederer, Bertrand Parvais, A. Mercha et al. · 2006 · 65 citations