M. Dehan

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Geert Van der Plas, Paresh Limaye, Igor Loi et al. · IEEE Journal of Solid-State Circuits · 2010 · 308 citations

Engineering, Vlsi Design, 3-D Chip Stacks +17

Influence of device engineering on the analog and RF performances of SOI MOSFETs

Valeriya Kilchytska, Amaury Nève, Laurent Vancaillie et al. · IEEE Transactions on Electron Devices · 2003 · 227 citations

Engineering, Analog Design, Rf Performances +17

Planar Bulk MOSFETs Versus FinFETs: An Analog/RF Perspective

V. Subramanian, Bertrand Parvais, Jonathan Borremans et al. · IEEE Transactions on Electron Devices · 2006 · 150 citations

Device Modeling, Low-power Electronics, Electrical Engineering +10

What are the limiting parameters of deep-submicron MOSFETs for high frequency applications?

G. Dambrine, C. Raynaud, Dimitri Lederer et al. · IEEE Electron Device Letters · 2003 · 119 citations

Device Modeling, Low-power Electronics, Electrical Engineering +15

Impact of fin width on digital and analog performances of n-FinFETs

V. Subramanian, A. Mercha, Bertrand Parvais et al. · Solid-State Electronics · 2007 · 97 citations

Electrical Engineering, Engineering, Analog Performances +3