Concepedia

Geometrical effect of bump resistance for flip-chip solder joints: Finite-element modeling and experimental results

Shuqi Liang, Chin Chen, Y. C. Liu, Kuei‐Hsien Chen, S. H. Lin

Journal of Electronic Materials · 2006 · 14 citations · 10 references

Concepts

EngineeringMaterials EngineeringMaterials ScienceFinite Element AnalysisFinite Element MethodsMechanical Behavior Of MaterialsDevice ModelingSolid Mechanics ApplicationsBump BehaviorFinite Element ModelingFlip-chip BondingFlip-chip BumpingSolder Joint StrengthSoldered JointsSolderingSoldering Joints

References

10

Recent advances on electromigration in very-large-scale-integration of interconnects

K. N. Tu · Journal of Applied Physics · 2003 · 1.1K citations

Engineering, Electrical Engineering, Materials Science +17

Tin–lead (SnPb) solder reaction in flip chip technology

K. N. Tu, Ke Zeng · Materials Science and Engineering R Reports · 2001 · 589 citations

Engineering, Materials Engineering, Materials Science +10

Foreword contributions from the 50th electronic components and technology conference

R. Boudreau · IEEE Transactions on Advanced Packaging · 2001 · 519 citations

Engineering, Computer Engineering, Electrical Engineering +16

A direct measurement of interfacial contact resistance

S.J. Proctor, L.W. Linholm · IEEE Electron Device Letters · 1982 · 140 citations

Engineering, Electrical Engineering, Materials Science +17

Analysis and scaling of Kelvin resistors for extraction of specific contact resistivity

W.M. Loh, Krishna C. Saraswat, R.W. Dutton · IEEE Electron Device Letters · 1985 · 67 citations

Natural Sciences, Electrical Engineering, Materials Science +16