Concepedia

Y. C. Liu

YC

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Publications

1

Citations

14

H-Index

1

Active since

2006

Affiliations

Industrial Technology Research Institute(Current)

Y. C. Liu is an author at Industrial Technology Research Institute specializing in finite element modeling, flip-chip bonding, and solid mechanics applications.

Publications per year

2006–2006

1

Publications

1

Geometrical effect of bump resistance for flip-chip solder joints: Finite-element modeling and experimental results

Shuqi Liang, Chin Chen, Y. C. Liu et al. · Journal of Electronic Materials · 2006 · 14 citations

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