2014 · 20 citations · 16 references
EngineeringComputer EngineeringElectrical EngineeringMicroelectronicsSemiconductor DevicesVlsi DesignBuilt-in Self-testCmos Circuit DesignDevice CharacterizationDevice ModelingDevice ReliabilitySemiconductor ReliabilityBias Temperature InstabilityCmos ReliabilityDynamic LogicGate Oxide DegradationPositive Bias Temperature InstabilityReliability DegradationReliability Degradation MechanismsSilicon
We consider in detail the aspects of maximizing application performance while maintaining its sufficient reliability on the specific case of serially connected nFETs. Serially connected nFETs used in some digital CMOS applications, such as SRAM decoder circuits, and dynamic logic, are vulnerable to Positive Bias Temperature Instability (PBTI). Here we discuss the impact of PBTI frequency and workload on high-k/metal gate nFETs in terms of Capture and Emission Time (CET) maps and quantitatively explain the degradation of our test circuit. This constitutes one of the first validations of the CET map-based methodology on a real silicon circuit. From individual trapping events in deeply scaled nFETs we then project PBTI distributions at 10 years. We further show that at increased supply voltage the serially connected nFET speed degradation is outweighed by signal transfer speedup, resulting in a net performance improvement. Finally, we discuss other degradation mechanisms and conclude the reliability in the studied case will be limited by hard gate oxide breakdown.
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Ubiquitous relaxation in BTI stressing—New evaluation and insights
B. Kaczer, Tibor Grasser, Jean-Marc Roussel et al. · 2008 · 249 citations
Analytic modeling of the bias temperature instability using capture/emission time maps
Tibor Grasser, P.-J. Wagner, H. Reisinger et al. · 2011 · 179 citations