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Six cases of reliability study of Pb-free solder joints in electronic packaging technology

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Reliability, Electrical Engineering, Reliability Engineering +10

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Mauro Ciappa · Microelectronics Reliability · 2002 · 955 citations

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Grain Growth in Thin Films

Carl V. Thompson · Annual Review of Materials Science · 1990 · 628 citations

Materials Science, Grain Orientations, Engineering +9

Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal history

P. A. Flinn, Donald S. Gardner, William D. Nix · IEEE Transactions on Electron Devices · 1987 · 583 citations

Engineering, Mechanical Engineering, Film Composition +21