Mechanical properties of thin films

References

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	Year	Citations
The relation between load and penetration in the axisymmetric boussinesq problem for a punch of arbitrary profile I. N. Sneddon International Journal of Engineering Science Numerical AnalysisEngineeringImpact (Mechanics)Axisymmetric Boussinesq ProblemMechanics	1965	4.3K
Defects in epitaxial multilayers I. Misfit dislocations Jacqueline M. Matthews Journal of Crystal Growth Dislocation InteractionMisfit DislocationsApplied PhysicsDefect FormationEpitaxial Growth	1974	3.1K
A method for interpreting the data from depth-sensing indentation instruments M. Doerner, William D. Nix Journal of materials research/Pratt's guide to venture capital sources Geometric ModelingEngineeringMeasurementCalibrationCivil Engineering	1986	2.8K
Hardness measurement at penetration depths as small as 20 nm J. B. Pethicai, R. Hutchings, W. C. Oliver Philosophical magazine. A/Philosophical magazine. A. Physics of condensed matter. Structure, defects and mechanical properties EngineeringSevere Plastic DeformationMicromechanicsMechanical EngineeringHardness	1983	923
Elastic analysis of some punch problems for a layered medium R. B. King International Journal of Solids and Structures Materials ScienceNonlinear ElasticityEngineeringElasticity (Physics)Mechanics	1987	870
Defects associated with the accommodation of misfit between crystals J. W. Matthews Journal of Vacuum Science and Technology EngineeringThin Film Process TechnologyDislocation SourcesPartial DislocationsQuantum Materials	1975	694
Ge<i>x</i>Si1−<i>x</i>/Si strained-layer superlattice grown by molecular beam epitaxy J. C. Bean, L. C. Feldman, A. T. Fiory, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films SemiconductorsMaterials EngineeringMaterials ScienceOxide HeterostructuresEngineering	1984	676
Crystal Interfaces. Part II. Finite Overgrowths J. H. van der Merwe Journal of Applied Physics EngineeringMechanical EngineeringMechanics Of MaterialsInfinitely Thick FilmMicrostructure-strength Relationship	1963	667
Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal history P. A. Flinn, Donald S. Gardner, William D. Nix IEEE Transactions on Electron Devices EngineeringMechanical EngineeringFilm CompositionCold WorkingResidual Stress	1987	583
Relaxation of strained-layer semiconductor structures via plastic flow Brian W. Dodson, Jeffrey Y. Tsao Applied Physics Letters Relaxation KineticsEngineeringSevere Plastic DeformationStrained-layer Semiconductor StructuresMechanics Of Materials	1987	550

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