Selected failure mechanisms of modern power modules

Lifetime prediction of IGBT modules for traction applications

Mauro Ciappa, Wolf Fïchtner · 2002 · 102 citations

Engineering, Electrical Engineering, Materials Science +17

Reliability and lifetime evaluation of different wire bonding technologies for high power IGBT modules

A. Hamidi, N. Beck, E. Herr · Microelectronics Reliability · 1999 · 95 citations

Engineering, Electrical Engineering, Materials Science +16

Crack mechanism in wire bonding joints

S. Ramminger, P. Türkes, G. Wachutka · Microelectronics Reliability · 1998 · 78 citations

Natural Sciences, Materials Engineering, Materials Science +13

Numerical analysis of short-circuit safe operating area for p-channel and n-channel IGBTs

Noriyuki Iwamuro, A. Okamoto, S. Tagami et al. · IEEE Transactions on Electron Devices · 1991 · 70 citations

Engineering, Electrical Engineering, Materials Science +17

Thermal Cycling and Surface Reconstruction in Aluminum Thin Films

Carlo Santoro · Journal of The Electrochemical Society · 1969 · 70 citations

Natural Sciences, Materials Engineering, Materials Science +17