Study on the fluid/structure interaction at different inlet pressures in molded packaging

“JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY”

Journal of the American Ceramic Society · 1923 · 1.1K citations

Natural Sciences, Chemical Engineering, Chemistry +10

Foreword contributions from the 50th electronic components and technology conference

R. Boudreau · IEEE Transactions on Advanced Packaging · 2001 · 519 citations

Engineering, Computer Engineering, Electrical Engineering +16

Recent Advances in Flip-Chip Underfill: Materials, Process, and Reliability

Zhe Zhang, C.P. Wong · IEEE Transactions on Advanced Packaging · 2004 · 243 citations · Full text

Engineering, Materials Engineering, Materials Science +17

An analytical model for predicting the underfill flow characteristics in flip-chip encapsulation

J.W. Wan, Wenjun Zhang, Donald J. Bergstrom · IEEE Transactions on Advanced Packaging · 2005 · 74 citations

Engineering, Computer Engineering, Materials Engineering +15

Three-Dimensional Modeling of Mold Filling in Microelectronics Encapsulation Process

R. Y. Chang, Wenli Yang, S.-J. Hwang et al. · IEEE Transactions on Components and Packaging Technologies · 2004 · 73 citations

Engineering, Computational Engineering, Manufacturing Engineering +13